1. 2. 3. material content data sheet sales product name tle7259-3ge issued 28. august 2013 ma# MA001102856 package pg-dso-8-16 weight* 83.29 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.228 2.67 2.67 26744 26744 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 108 non noble metal zinc 7440-66-6 0.036 0.04 431 non noble metal iron 7439-89-6 0.717 0.86 8611 non noble metal copper 7440-50-8 29.121 34.96 35.87 349625 358775 wire noble metal gold 7440-57-5 0.193 0.23 0.23 2323 2323 encapsulation organic material carbon black 1333-86-4 0.097 0.12 1160 plastics epoxy resin - 4.443 5.33 53344 inorganic material silicondioxide 60676-86-0 43.755 52.55 58.00 525319 579823 leadfinish non noble metal tin 7440-31-5 0.814 0.98 0.98 9771 9771 plating noble metal silver 7440-22-4 0.650 0.78 0.78 7807 7807 glue plastics acrylic resin - 0.270 0.32 3247 noble metal silver 7440-22-4 0.959 1.15 1.47 11510 14757 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
